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MC10176 Hex D Master/Slave Flip-Flop
The MC10176 contains six high-speed, master slave type "D" flip-flops. Clocking is common to all six flip-flops. Data is entered into the master when the clock is low. Master to slave data transfer takes place on the positive-going Clock transition. Thus, outputs may change only on a positive-going Clock transition. A change in the information present at the data (D) input will not affect the output information any other time due to the master-slave construction of this device. * PD = 460 mW typ/pkg (No Load) * ftoggle = 150 MHz (typ) * tr, tf = 2.0 ns typ (20%-80%)
LOGIC DIAGRAM
D0 5 2 Q0 PLCC-20 FN SUFFIX CASE 775
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16 CDIP-16 L SUFFIX CASE 620 1 16 PDIP-16 P SUFFIX CASE 648 1 MC10176P AWLYYWW 1 10176 AWLYYWW MC10176L AWLYYWW
D1
6
3
Q1
D2
7
4
Q2
A WL YY WW
= Assembly Location = Wafer Lot = Year = Work Week
DIP PIN ASSIGNMENT
D3 10 13 Q3 VCC1 Q0 D4 11 14 Q4 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 CLOCK D5 9 12 15 Q5 Q1 Q2 D0 D1 D2 VEE 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC2 Q5 Q4 Q3 D5 D4 D3 CLOCK
CLOCKED TRUTH TABLE
C L H* H* D X L H Qn+1 Qn L H
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D).
ORDERING INFORMATION
Device MC10176L MC10176P MC10176FN Package CDIP-16 PDIP-16 PLCC-20 Shipping 25 Units / Rail 25 Units / Rail 46 Units / Rail
*A clock H is a clock transition from a low to a high state.
(c) Semiconductor Components Industries, LLC, 2002
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January, 2002 - Rev. 7
Publication Order Number: MC10176/D
MC10176
ELECTRICAL CHARACTERISTICS
Test Limits Pin Under Test 8 5 9 5 9 2[ 15[ 2[ 15[ 2[ 15[ 2[ 15[ 0.5 0.5 -1.060 -1.060 -1.890 -1.890 -1.080 -1.080 -1.655 -1.655 -0.890 -0.890 -1.675 -1.675 -30C Min Max 121 350 495 0.5 0.5 -0.960 -0.960 -1.850 -1.850 -0.980 -0.980 -1.630 -1.630 -0.810 -0.810 -1.650 -1.650 Min +25C Typ 88 Max 110 220 310 0.3 0.3 -0.890 -0.890 -1.825 -1.825 -0.910 -0.910 -1.595 -1.595 -0.700 -0.700 -1.615 -1.615 Min +85C Max 121 220 310 Unit mAdc Adc Adc Vdc Vdc Vdc Vdc ns t9+2+ t9+2- t2+ t2- tsetup thold ftog 2 2 2 2 2 2 2 1.6 1.6 1.0 1.0 2.5 1.5 125 4.6 4.6 4.1 4.1 1.6 1.6 1.1 1.1 2.5 1.5 125 150 VIHmax VILmin 4.5 4.5 4.0 4.0 1.6 1.6 1.1 1.1 2.5 1.5 125 5.0 5.0 4.4 4.4 ns ns MHz
Characteristic Power Supply Drain Current Input Current
Symbol IE IinH IinL
Output Voltage Output Voltage Threshold Voltage Threshold Voltage
Logic 1 Logic 0 Logic 1 Logic 0
VOH VOL VOHA VOLA
Switching Times (50 Load) Clock Input Propagation Delay Rise Time Fall Time Setup Time Hold Time Toggle Frequency (Max) (20 to 80%) (20 to 80%)
[ Output level to be measured after a clock pulse has been applied to the C Input (Pin 9)
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MC10176
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts) @ Test Temperature -30C +25C +85C Pin Under Test 8 5 9 5 9 2[ 15[ 2[ 15[ 2[ 15[ 2[ 15[ +1.11Vdc t9+2+ t9+2- t2+ t2- tsetup thold ftog 2 2 2 2 2 2 2 VIHmax VILmin +0.31V Pulse In 5, 9 5, 9 5, 9 5, 9 5, 9 5, 9 5 12 5 12 5 12 5 12 Pulse Out 2 2 2 2 2 2 5 9 5 9 VIHmax -0.890 -0.810 -0.700 VILmin -1.890 -1.850 -1.825 VIHAmin -1.205 -1.105 -1.035 VILAmax -1.500 -1.475 -1.440 VEE -5.2 -5.2 -5.2 (VCC) Gnd 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 +2.0 V 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16
TEST VOLTAGE APPLIED TO PINS LISTED BELOW VIHmax VILmin VIHAmin VILAmax VEE 8 8 8 8 8 8 8 8 8 8 8 8 8 -3.2 V 8 8 8 8 8 8 8
Characteristic Power Supply Drain Current Input Current
Symbol IE IinH IinL
Output Voltage Output Voltage Threshold Voltage Threshold Voltage Switching Times Clock Input
Logic 1 Logic 0 Logic 1 Logic 0 (50 Load) Propagation Delay
VOH VOL VOHA VOLA
Rise Time Fall Time Setup Time Hold Time Toggle Frequency (Max)
(20 to 80%) (20 to 80%)
[ Output level to be measured after a clock pulse has been applied to the C Input (Pin 9)
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50-ohm resistor to -2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner.
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MC10176
PACKAGE DIMENSIONS
PLCC-20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C
B -N- Y BRK D -L- -M- W D X V A Z R 0.007 (0.180) 0.007 (0.180)
M
0.007 (0.180) U
M
T L-M
M
S
N
S S
0.007 (0.180)
T L-M
N
S
Z
20
1
G1
0.010 (0.250)
S
T L-M
S
N
S
VIEW D-D T L-M T L-M
S
N N
S
H
0.007 (0.180)
M
T L-M
S
N
S
M
S
S
K1 K
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
F VIEW S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
0.007 (0.180)
M
T L-M
S
N
S
VIEW S
S
N
S
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --0.025 --0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --0.64 --8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --0.50 2_ 10 _ 7.88 8.38 1.02 ---
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MC10176
PACKAGE DIMENSIONS
CDIP-16 L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE T
-A-
16 9
-B-
1 8
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
-T-
SEATING PLANE
N E F D G
16 PL
K M J
16 PL
0.25 (0.010)
M
M
TB
S
0.25 (0.010)
TA
S
-A-
16 9
PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
B
1
8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
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MC10176
Notes
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MC10176
Notes
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MC10176
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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MC10176/D

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